CAMPBELL, Calif.--(BUSINESS WIRE)--Sigrity, Inc., the market leader in signal and power integrity solutions, today introduced XcitePI IO Interconnect Model Extraction as part of the company’s ...

Microwave designers have long been aware of the importance of proper interconnect design as a critical step to successful circuit performance. As a matter of fact, one of the distinguishing features ...

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

Advanced interconnect materials and technologies represent a pivotal aspect of modern integrated circuits, addressing both the miniaturisation of device architectures and the increasing performance ...

For chips designed at advanced technology nodes, interconnect is the dominant contributor towards delay, power consumption, and reliability. Major interconnects such as clock trees, power distribution ...

Integrated circuit (IC) designers move to advanced process technology nodes to leverage higher performance, density, and functionality, as well as reduced delay and power consumption, enabled by ...

1. Metal layers are made thicker in this SRAM cell to compensate for the higher resistance caused by narrower wires. 2. As process feature size decreases, metal thickness and vertical spacing doesn’t ...

UMG Technologies Inc. in Danvers, Mass., makes highspeed tab inserters used in the assembly of printed circuit boards for automotive and consumer interconnect devices. The company’s PLT-901 dual-head ...

CAMPBELL, Calif.-- May 14, 2012-- Sigrity, Inc., the market leader in signal and power integrity solutions, today introduced XcitePI IO Interconnect Model Extraction as part of the company’s ...