Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia CEO Huang confirms its TSMC advanced packaging needs are shifting: report
CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial intelligence chip,
Nvidia Expands Capacity with TSMC's Advanced Packaging
Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The company aims to increase capacity, not reduce it, as demand grows. Jensen Huang,
Nvidia's visit to SPIL highlights its emphasis on advanced packaging
Nvidia CEO Jensen Huang's visit to Siliconware Precision Industries (SPIL) on his current trip to Taiwan has garnered market attention to the company's emphasis on advanced packaging.
Nvidia CEO says advanced packaging needs are changing
TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia increases demand for TSMC's advanced packaging
Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC), its main contract chipmaker, although the type of technology it requires is shifting,
US announces $1.4 bln support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...
Electronic Design13h
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
Micron To Build $7 Billion Advanced Chip Facility In Singapore Amid AI Boom
Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...
ThePrint23h
US announces $1.4 billion support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
Digi Times5h
US govt commits US$1.4 billion to domestic chip packaging
The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging ...
Semiconductor Engineering1d
Advanced Packaging: A Curse Or A Blessing For Trustworthiness?
The field of advanced packaging in particular is undergoing significant change, and this presents both opportunities and ...
ASU finalizes $1 billion in CHIPS Act funding
ASU is about to get its hands on $1 billion worth of federal government funding for cutting-edge projects to advance the ...