Samsung Electronics and Texas Instruments finalized agreements for billions in US government funding under the CHIPS Act, boosting domestic semiconductor production. Samsung will receive $4.75 billion ...

Intel's Sanjay Natarajan highlights Moore's Law's economic foundation & global influence. As physical limits loom, cutting-edge technologies like advanced packaging & Selective Layer Transfer push ...

Synopsys' AI strategy lead Stelios Diamantidis predicts AI agents will collaborate by 2025, driving the next phase of AI deployment. These agents, evolving from simple bots to sophisticated systems, ...

Qualcomm secured a legal victory against Arm Holdings, with jurors finding no breach of a chip technology license tied to Qualcomm's $1.4 billion Nuvia acquisition. However, Arm plans to seek a ...

TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. With fresh investments from OSAT ...

The Arm vs. Qualcomm trial has concluded with closing arguments, leaving the jury to deliberate. TIRIAS Research analysts Jim McGregor and Francis Sideco explore case insights and implications, ...

Google's quantum chip, Willow, delivers groundbreaking speed, solving tasks in minutes that would take supercomputers septillions of years. Despite cryptographic concerns, it paves the way for quantum ...

The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks. The investigation may lead to ...

WeEn Semiconductor introduces top-side-cooling SiC devices in TSPAK and TOLT packages, reducing thermal resistance by 17%-19%. These innovative components boost ...

Google's quantum chip, Willow, sets a new benchmark with its speed and enhanced error correction. Experts highlight its potential to disrupt cryptocurrency security ...

SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances AI efficiency and reliability while addressing semiconductor scaling and data transmission challenges ...