Scientists have uncovered a new explanation for how swimming bacteria change direction, providing fresh insight into one of ...
Chipmaker Marvell Technology Inc. said today it has agreed to acquire a networking startup called Celestial AI Inc. that’s developing optical interconnect technology to enable more rapid data center ...
As AI computing power rapidly scales, electronic system interconnect demands are shifting from traditional terminal structure optimization to comprehensive integration of high-speed signal integrity, ...
Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new line of rugged, multi-port SMPM solutions that feature threaded coupling for high ...
Smiths Group SMIN1.77%increase; green up pointing triangle said it agreed to sell electric components manufacturer Smiths Interconnect to Koch’s Molex Electronic Technologies in a deal that gives the ...
The demand for high bandwidth memory (HBM) is accelerating across the semiconductor industry, driven by boundary-pushing artificial intelligence, high-performance computing, and advanced graphics.
While the Silicon 100 report was being compiled and curated to profile the most promising startups in the semiconductor industry in 2025, two prominent chiplet upstarts were already taken. First, ...
With cloud computing, HPC, and now AI driving enterprise computing and the technical challenges and cost connected to semiconductor design and manufacturing increasing, demand for chiplet ...
The market for Compute Express Link (CXL) products will enjoy rapid growth to nearly $3.4 billion by 2028 as servers come to market with the technology. That’s the conclusion of a new report from ...
Ottawa-based deep-tech startup Hyperlume is poised to disrupt the landscape of AI and high-performance computing with its innovative optical interconnect solutions. The company is tackling the growing ...
A new technical paper titled “FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates” was published by researchers at ETH Zurich. “Chiplet ...
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